ISBN 9781845699376,Electromigration in Thin Films and Electronic Devices

Electromigration in Thin Films and Electronic Devices

Author:

C.-U. Kim

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ISBN 9781845699376
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ISBN 9781845699376
Publisher

Woodhead Publishing

Publication Year 2011
ISBN-13

ISBN 9781845699376

ISBN-10 1845699378
Binding

Hardback

Number of Pages 352 Pages
Subject

Electronic devices & materials

Recent research has focussed on how electromigration affects the increasing use by the microelectronics industry of lead-free solders and copper interconnects. Part one reviews ways of modelling and testing electromigration, part two discusses electromigration in copper interconnects and part three covers solder and wirebonds.

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