Oxford University Press
|Number of Pages
The Science and Engineering of Microelectronic Fabrication provides a thorough and accessible introduction to the field of microfabrication.
Revised and expanded in this second edition, the text covers all the basic unit processes used to fabricate integrated circuits, including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering, and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of the current state-of-the-art devices. Each chapter includes sample problems with solutions. The text makes use of the popular process simulation package SUPREM to provide more meaningful examples of the type of real-world dopant redistribution problems that microelectronic fabrication engineers must face.
This new edition includes a chapter on microelectromechanical structures (MEMS), an exciting new area in microfabrication. The coverage of MEMS includes fundamentals of mechanics; stress in thin films; mechanical to electrical transduction; mechanics of common MEMS devices; bulk micromachining etching techniques; bulk micromachining process flow; surface micromachining basics; surface micromachining process flow; MEMS actuators; and high aspect ratio microsystems technology (HARMST).
Powerpoint overheads are available free to adopting professors.
Complete and careful revision of all aspects of text and references
New full chapter on MEMS including: Fundamentals of Mechanics, Stress in Thin Films, Mechanical to Electrical Transduction, Mechanics of Common MEMS Devices, Bulk Micromachining Etching Techniques, Bulk Micromachining Process Flow, Surface Micromachining Basics, Surface Micromachining Process Flow, MEMS.
Actuators, High Aspect Ratio Microsystems Technology (HARMST).
Uses popular readily available software including SUPREM III.
Accessible to both advanced engineering students and professionals.
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TABLE OF CONTENTS
Overview and Materials
An Introduction to Microelectronic Fabrication
Unit Process 1: Hot Processing and Ion Implantation
Rapid Thermal Processing
Unit Processes 2: Pattern Transfer
Nonoptical Lithographic Techniques
Vacuum Science and Plasmas
Unit Processes 3: Thin Films
Physical Deposition: Evaporation and Sputtering
Chemical Vapor Deposition
Device Isolation, Contacts, and Metallization
Silicon Bipolar Technologies
Integrated Circuit Manufacturing